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| PL IA NT Features RoHS compliant* ESD protection >25 kV Low capacitance <0.5 pF Low leakage current <50 nA Applications HDMI 1.4 Digital Visual Interface (DVI) USB 3.0 / USB OTG Memory protection SIM card ports *R oH S CO M ChipGuard(R) MLC Series - ESD Protectors General Information The ChipGuard(R) MLC Series has been specifically designed to protect sensitive electronic components from electrostatic discharge damage. The MLC family has been designed to protect equipment to IEC61000-4-2, Level 4 (8 kV Contact / 15 kV Air Discharge) ESD specifications targeted for high speed USB 3.0/USB OTG, HDMI 1.4, DVI or IEEE1394 applications. The ChipGuard(R) MLC Series has been manufactured to provide low 0.5 pF capacitance and leakage currents less than 50 nA with excellent clamp qualities, making the family almost transparent under normal working conditions. Device Symbol V Electrical Characteristics @ 25 C (unless otherwise noted) CG0402MLCParameter Symbol 3.3LG 05LG 12LG 3.3LGA 05LGA 12LGA 3.3LE 05E 05LE CG0603MLC12E 12LE 3.3LEA 05LEA 12LEA Unit Typical Continuous Operating Voltage Typical Clamping Voltage (Note 1) Maximum Capacitance @ 1 VRMS 1 MHz Maximum Leakage Current @ Max. VDC Typical Trigger Voltage (Note 2) Maximum Response Time ESD Protection: Per IEC 61000-4-2 Level 4 Min. Contact Discharge Min. Air Discharge Min. Air Discharge Operating Temperature Storage Temperature VDC VC CO IL VT RT 3.3 25 5 25 12 25 3.3 25 5 25 12 25 3.3 25 5 20 0.5 5 25 12 30 12 25 3.3 25 5 25 12 25 V V pF 5 250 5 250 5 250 5 250 5 250 5 250 5 50 5 50 150 5 250 5 250 5 250 5 250 nA V ns 250 150 250 1 8 15 (Note 3) 25 TOPR TSTG -40 to +85 -40 to +125 -40 to +85 -55 to +150 -40 to +125 kV kV kV C C Notes: 1. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement 30 ns after initiation of pulse. 2. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement at maximum pulse voltage. 3. IEC 61000-4-2 ESD Performance for CG0603MLC-05E and CG0603MLC-12E devices will meet minimum 100 reps. Some shifting in characteristics may occur when tested over several hundred ESD pulses. All other part numbers listed will meet IEC 61000-4-2 ESD Performance with minimum 1000 reps without degradation in performance. *RoHS Directive 2002/95/EC Jan 27 2003 including Annex. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. ChipGuard(R) MLC Series - ESD Protectors Product Dimensions A Recommended Pad Layout A W DIMENSIONS: B MM (INCHES) L C D B Dimension L W A B CG0402 Series 1.00 0.15 (0.04 0.006) 0.50 0.10 (0.02 0.004) 0.36 0.05 (0.014 0.002) 0.25 0.15 (0.10 0.006) CG0603 Series 1.60 0.20 (0.064 0.008) 0.80 0.20 (0.032 0.008) 0.45 0.10 (0.018 0.004) 0.30 0.20 (0.012 0.008) Dim. A B C D CG0402 Series 0.51 (0.020) 0.61 (0.024) 0.51 (0.020) 1.70 (0.067) CG0603 Series 0.76 (0.030) 1.02 (0.040) 0.50 (0.020) 2.54 (0.100) Solder Reflow Recommendations 300 250 200 150 100 50 0 110 sec. (min.) 30-70 sec. Time (seconds) 120 sec. (min.) Preheat Stages 1-3 Soldering Cooling A B C D Stage 1 Preheat Stage 2 Preheat Stage 3 Preheat Main Heating Ambient to Preheating Temperature 140 C to 160 C Preheat to 200 C 200 C 210 C 220 C 230 C 240 C 200 C to 100 C 30 s to 60 s 60 s to 120 s 20 s to 40 s 60 s to 70 s 55 s to 65 s 50 s to 60 s 40 s to 50 s 30 s to 40 s 1 C/s to 4 C/s Temperature (C) E Cooling * * * * This product can be damaged by rapid heating, cooling or localized heating. Heat shocks should be avoided. Preheating and gradual cooling recommended. Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended. Solder gun tip temperature should be kept below 280 C and should not touch the device directly. Contact should be less than 3 seconds. A solder gun under 30 watts is recommended. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. ChipGuard(R) MLC Series - ESD Protectors Packaging Dimensions 13.0 1.0 (0.52 0.04) 8.00 0.30 (0.32 0.012) 4.00 0.10 (0.16 0.004) C 1.50 0.10 (0.06 0.004) 2.0 0.50 (0.08 0.02) 62.0 1.50 (2.48 0.06) 13.0 0.50 (0.52 0.02) L TOP TAPE W G D 3.50 0.05 (0.14 0.002) 21.0 0.80 (0.84 0.032) 180.8 2.0 (7.12 0.08) NOTES: TAPE MATERIAL IS PAPER. 0.60 0.05 TAPE THICKNESS IS (0.024 0.002) COVER TAPE ADHESION IS 40 15 GRAMS. DIMENSIONS: MM (INCHES) 9.0 0.50 (0.36 0.02) Dimension C D L W G CG0402 Series 1.75 0.05 (0.04 0.002) 2.00 0.02 (0.08 0.0008) 1.12 0.03 (0.045 0.0012) 0.62 0.03 (0.025 0.0012) 2.0 0.05 (0.08 0.002) CG0603 Series 1.75 0.10 (0.04 0.004) 2.00 0.05 (0.08 0.002) 1.80 0.20 (0.072 0.008) 0.90 0.20 (0.036 0.008) 4.0 0.05 (0.16 0.002) How to Order CG 0402 MLC - 12 L G A ChipGuard Product Designator Package Option 0402 = 0402 Package 0603 = 0603 Package Multilayer Series Designator Operating Voltage 3.3 = 3.3 V 05 = 5 V 12 = 12 V Low Leakage Current Option L = Low Leakage Current Blank = Standard Product Tape & Reel Packaging E = 5,000 pcs. per reel (0603 Package) G = 10,000 pcs. per reel (0402 Package) Operating Temperature Option A = Higher +125 C Operating Temperature Blank = Standard Product (R) Asia-Pacific: TEL +886-2 25624117 * FAX +886-2 25624116 Europe: TEL +41-41 7685555 * FAX +41-41 7685510 The Americas: TEL +1-951 781-5500 * FAX +1-951 781-5700 www.bourns.com REV. N 11/09 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. |
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